Redline Group Ltd is seeking a Mechanical Engineer specialising in Microelectronic Products, based in Milton Keynes, Buckinghamshire, with hybrid working and a 9-day fortnight. You will develop microelectronic products for harsh environments and collaborate across electronic design, reliability, manufacturing, process, test and quality to ensure robust packaging and assembly methods.
Ideal candidates will have proven experience in thermal and stress analysis, proficiency in SOLIDWORKS and
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We are currently recruiting a Hybrid Mechanical Engineer - Microelectronic Packaging & Thermal for our team in Gorleston-on-Sea, England, United Kingdom.
Our organisation is growing, and we are hiring a Hybrid Mechanical Engineer - Microelectronic Packaging & Thermal in Gorleston-on-Sea, England, United Kingdom.
This position is for the Hybrid Mechanical Engineer - Microelectronic Packaging & Thermal role at Redline Group.
We are seeking a motivated Hybrid Mechanical Engineer - Microelectronic Packaging & Thermal to join Redline Group in Gorleston-on-Sea, England, United Kingdom.