Pragmatic Semiconductor is seeking a Principal Advanced Packaging Engineer to lead the technical development of FlexIC wafer-level and chip-scale packaging, die attachment, and system integration across Sedgefield and Durham sites. The role requires deep experience in semiconductor packaging, MEMS/flexible electronics, and cross-functional collaboration.
Visa sponsorship and relocation assistance are available.
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The Principal Advanced Packaging Engineer: Lead FlexIC Packaging position in the Engineering field is open for applications.
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This posting is for the Principal Advanced Packaging Engineer: Lead FlexIC Packaging role at PragmatIC Semiconductor, based in Tees Valley, England, United Kingdom.
We are looking to fill the Principal Advanced Packaging Engineer: Lead FlexIC Packaging position at PragmatIC Semiconductor in Tees Valley, England, United Kingdom.