Quantum Motion, a London-based quantum computing scale-up, seeks a senior engineering leader with 7+ years in 3D integration (TSVs, fine-pitch microbumps, flip-chip bonding, multi-chip modules) to build and scale high-performance teams.
You will oversee transfers with external semiconductor foundries and drive technology programs across ICs and cryogenic electronics, shaping the roadmap for silicon CMOS quantum processors.
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We are seeking a motivated Senior 3D Integration Engineer – Advanced Packaging to join Entangled Future in Greater London, England, United Kingdom.
We have an opening for a Senior 3D Integration Engineer – Advanced Packaging in Greater London, England, United Kingdom within Engineering.
This role, Senior 3D Integration Engineer – Advanced Packaging at Entangled Future, could be your next career step.
Are you ready to take on the Senior 3D Integration Engineer – Advanced Packaging role at Entangled Future?